R&D Engineer Adv Tech Dev 4
Company: Broadcom Inc.
Location: Irvine
Posted on: May 26, 2023
Job Description:
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please Sign-In before you apply.Job Description:
- Establish, enhance, calibrate and/or maintain in-house IC
Package Mechanical Reliability Test Facilities such as Temperature
Cycling Chamber, High Current Electromigration testers, Drop
testers and Warpage Measurement system
- Formulate DOEs and run above tests on large number of IC
package samples, for engineering characterization and
product/technology qualification for interconnect reliability at
the package and board levels
- Liaison with external labs for running environmental stress
tests for product/technology qualification per in-house and
customer specifications, performing failure analysis & root-causing
the failures and determine the corrective actions
- Work closely with IC Package Design and Technology Development
engineers for IC packaging material characterization,
Chip-Package-Interaction for new silicon process node technologies
and new package technology qualification
- Perform Finite Element Modeling and Analysis for studying the
warpage behavior of IC packaging structures and the stress on
bump/ball interconnects
- Work with Thermal and Signal/Power Integrity engineers for
co-simulation and testing for co-design
- Collaborate with teams from external customers, Broadcom
Business Units and the QA department and help debug mechanical
failures during stress tests and in the field, if any, and find
appropriate remediesJob Requirements
- BS/MS/PHD in Mechanical Engineering / Material Science
- Minimum work experience: 8+ years for Bachelors / 6+ years for
Masters / 3+ years for Ph.D. in IC packaging reliability
- Hands on experience with IC Package mechanical reliability
testers such as Temperature Cycle Chamber, Drop tester and/or
Electromigration tester and a DYI attitude to build, maintain and
fix these machines
- Power user of Finite Element Modeling tools such as Ansys
Mechanical and hands on experience with mechanical design tools
such as AutoCAD and/or layout tools such as Cadence APD
- Strong fundamentals on the materials science and mechanical
behavior of IC packaging structures with heterogeneous material
stacks and interconnect structures under different thermal,
mechanical and electrical stress conditions
- Knowledge on IC package assembly processes such as flip chip,
wirebonding and surface mounting and advanced packaging
technologies for heterogeneous integration using 2.5D/3D
stacking
- Track record of innovation through patents and
publicationsAdditional Job Description:Compensation and BenefitsThe
annual base salary range for this position is $91,200-
$152,000.This position is also eligible for a discretionary annual
bonus in accordance with relevant plan documents, and equity in
accordance with equity plan documents and equity award
agreements.Broadcom offers a competitive and comprehensive benefits
package: Medical, dental and vision plans, 401(K) participation
including company matching, Employee Stock Purchase Program (ESPP),
Employee Assistance Program (EAP), company paid holidays, paid sick
leave and vacation time. The company follows all applicable laws
for Paid Family Leave and other leaves of absence.Broadcom is proud
to be an equal opportunity employer. We will consider qualified
applicants without regard to race, color, creed, religion, sex,
sexual orientation, gender identity, national origin, citizenship,
disability status, medical condition, pregnancy, protected veteran
status or any other characteristic protected by federal, state, or
local law. We will also consider qualified applicants with arrest
and conviction records consistent with local law.If you are located
outside USA, please be sure to fill out a home address as this will
be used for future correspondence.
Keywords: Broadcom Inc., Irvine , R&D Engineer Adv Tech Dev 4, Engineering , Irvine, California
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